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Dual-Station Picosecond Glass Laser Cutting Machine

The Dual-Station Picosecond Glass Laser Cutting Machine is engineered for high-precision processing of brittle and heat-sensitive materials such as glass, sapphire, and ceramics.
By integrating picosecond laser cold pre-cutting with RF CO₂ laser-controlled splitting, it delivers taperless edges, minimal chipping, and superior surface quality.
Equipped with granite motion control, intelligent CCD vision alignment, and dual-station platforms, this system ensures both accuracy and continuous productivity—making it the perfect choice for glass processing industries requiring ultimate precision and efficiency.

    Description

    This machine integrates two synchronized workstations, allowing continuous loading and unloading to boost productivity. The picosecond laser provides non-thermal cutting for delicate materials, while the CO₂ laser performs controlled splitting for clean separation.
    Equipped with CCD smart vision alignment, granite base motion platform, and Bezier non-contact focus head, it achieves micron-level precision. The intelligent control system enables automatic process switching between picosecond cutting and CO₂ splitting, ensuring consistency and efficiency across various glass thicknesses and shapes.

    Automatic double-station laser glass cutting platform

    Features 

    • Dual Laser Source Cutting & Splitting – Combines picosecond laser pre-cutting with RF CO₂ laser splitting for smooth, chip-free edges.
    • Dual Laser Channel Switching – Independent Bessel infrared and CO₂ channels enable seamless switching between cold and thermal processing.
    • CCD Auto-Positioning – Built-in CCD vision system ensures automatic alignment, edge detection, and defect recognition.
    • Dual-Station Platform – Alternating worktables support continuous production with minimal downtime.
    • Precision Motion System – Granite-based linear motor system ensures nano-level vibration stability and micron-level accuracy.
    • Smart Control System – Integrated software coordinates motion control, laser output, and monitoring for optimal performance.
    • Adaptive Power Modulation – Automatically adjusts power for various glass thicknesses and material types.
    • Customizable Table Sizes – Available in 600×700mm, 1000×2500mm, and 1500×3000mm configurations.
    • Efficient Cooling System – Advanced water cooling maintains temperature stability for continuous operation.
    • Taperless & Clean Cutting – Ensures smooth edges with <5μm chipping and <20μm dimensional accuracy.
    Picosecond laser head and CO2 splitting head assembly

    Parameters 

    Cutting Laser (Picosecond Source)

    Item Specification
    Laser Type Picosecond Pulse Laser
    Power 70W (Optional: 50W / 80W)
    Wavelength 1064nm, M² < 1.3
    Pulse Width <10ps
    Frequency Range 1Hz – 1000kHz
    Cooling Method Water Cooling
    Focus Head Bezier Focus Head
    Focus Spot Size <2μm
    Cutting Speed 0 – 300mm/s (Adjustable)
    Max Cutting Thickness ≤12mm (Varies by material)
    X/Y Working Area 500 × 600mm (Dual Platform)
    Dimensional Accuracy ≤20μm
    Edge Chipping <5μm

    Splitting Laser (RF CO₂ Source)

    Item Specification
    Laser Type RF CO₂ Laser
    Power 150W (Optional: 100W / 120W / 300W)
    Wavelength 10.6μm
    Cooling Method Water Cooling
    Focus Spot Size 3mm (Adjustable 2–5mm)
    Splitting Speed 0 – 300mm/s (Adjustable)

    Motion & Control System

    Item Specification
    Drive Type Direct Drive Motor + Servo Z-axis
    Processing Range 600 × 500mm
    X/Y Travel Range X: 1400mm / Y: 1800mm
    Z-axis Travel 50mm
    Max Movement Speed 600mm/s
    Positioning Accuracy (X/Y) ±3μm
    Repeat Positioning Accuracy (X/Y) ±2μm
    Platform Dual-Station Vacuum Suction Worktable
    Base Material Granite for Vibration Damping

    Vision & Monitoring

    Item Specification
    Camera 5MP CCD Intelligent Vision System
    Lighting Adjustable Ring-Type Illuminant
    Alignment Automatic Edge & Mark Point Recognition
    Software Material Presets, Process Monitoring, Fault Detection
     CO2 laser source for glass splitting section

    Applications 

    • Smartphone cover glass and display panel cutting
    • Watch lens and sapphire crystal processing
    • Automotive display and touch panel glass cutting
    • Optical lens and camera module glass machining
    • Flat glass and LED display glass cutting
    • Wafer and semiconductor glass processing
    • Special glass customization and precision optical components
    • High-end glass processing for consumer electronics
    Granite-based motion system for vibration-free laser processing

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