Dual-Station Picosecond Glass Laser Cutting Machine
Description
This machine integrates two synchronized workstations, allowing continuous loading and unloading to boost productivity. The picosecond laser provides non-thermal cutting for delicate materials, while the CO₂ laser performs controlled splitting for clean separation.
Equipped with CCD smart vision alignment, granite base motion platform, and Bezier non-contact focus head, it achieves micron-level precision. The intelligent control system enables automatic process switching between picosecond cutting and CO₂ splitting, ensuring consistency and efficiency across various glass thicknesses and shapes.

Features
- Dual Laser Source Cutting & Splitting – Combines picosecond laser pre-cutting with RF CO₂ laser splitting for smooth, chip-free edges.
- Dual Laser Channel Switching – Independent Bessel infrared and CO₂ channels enable seamless switching between cold and thermal processing.
- CCD Auto-Positioning – Built-in CCD vision system ensures automatic alignment, edge detection, and defect recognition.
- Dual-Station Platform – Alternating worktables support continuous production with minimal downtime.
- Precision Motion System – Granite-based linear motor system ensures nano-level vibration stability and micron-level accuracy.
- Smart Control System – Integrated software coordinates motion control, laser output, and monitoring for optimal performance.
- Adaptive Power Modulation – Automatically adjusts power for various glass thicknesses and material types.
- Customizable Table Sizes – Available in 600×700mm, 1000×2500mm, and 1500×3000mm configurations.
- Efficient Cooling System – Advanced water cooling maintains temperature stability for continuous operation.
- Taperless & Clean Cutting – Ensures smooth edges with <5μm chipping and <20μm dimensional accuracy.

Parameters
Cutting Laser (Picosecond Source)
| Item | Specification |
| Laser Type | Picosecond Pulse Laser |
| Power | 70W (Optional: 50W / 80W) |
| Wavelength | 1064nm, M² < 1.3 |
| Pulse Width | <10ps |
| Frequency Range | 1Hz – 1000kHz |
| Cooling Method | Water Cooling |
| Focus Head | Bezier Focus Head |
| Focus Spot Size | <2μm |
| Cutting Speed | 0 – 300mm/s (Adjustable) |
| Max Cutting Thickness | ≤12mm (Varies by material) |
| X/Y Working Area | 500 × 600mm (Dual Platform) |
| Dimensional Accuracy | ≤20μm |
| Edge Chipping | <5μm |
Splitting Laser (RF CO₂ Source)
| Item | Specification |
| Laser Type | RF CO₂ Laser |
| Power | 150W (Optional: 100W / 120W / 300W) |
| Wavelength | 10.6μm |
| Cooling Method | Water Cooling |
| Focus Spot Size | 3mm (Adjustable 2–5mm) |
| Splitting Speed | 0 – 300mm/s (Adjustable) |
Motion & Control System
| Item | Specification |
| Drive Type | Direct Drive Motor + Servo Z-axis |
| Processing Range | 600 × 500mm |
| X/Y Travel Range | X: 1400mm / Y: 1800mm |
| Z-axis Travel | 50mm |
| Max Movement Speed | 600mm/s |
| Positioning Accuracy (X/Y) | ±3μm |
| Repeat Positioning Accuracy (X/Y) | ±2μm |
| Platform | Dual-Station Vacuum Suction Worktable |
| Base Material | Granite for Vibration Damping |
Vision & Monitoring
| Item | Specification |
| Camera | 5MP CCD Intelligent Vision System |
| Lighting | Adjustable Ring-Type Illuminant |
| Alignment | Automatic Edge & Mark Point Recognition |
| Software | Material Presets, Process Monitoring, Fault Detection |

Applications
- Smartphone cover glass and display panel cutting
- Watch lens and sapphire crystal processing
- Automotive display and touch panel glass cutting
- Optical lens and camera module glass machining
- Flat glass and LED display glass cutting
- Wafer and semiconductor glass processing
- Special glass customization and precision optical components
- High-end glass processing for consumer electronics

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